Capabilities
We are a full service PCB supplier located in Arizona but we supply to customers throughout North America. We pride ourselves on being reliable and providing high quality PCBs for a wide range of applications and industries.
The information shown below details some of the key capabilities that RedBoard Circuits can offer and support through our Prototyping and Mass Production manufacturing facilities. You will find information regarding the materials, finishes and technologies that we support on our Products page.
| Drilling Aspect Ratio | 12:1 |
| Laser Blind Via Aspect Ratio | 0.5: 1 |
| Min. finish hole size (mechanical) | .006” |
| Min. finish hole size (laser drill) | .004” |
| Min. outer layer via land size | .012” |
| Min. inner layer via land size | .010” |
| Min. trace width/ spacing | .003/.003” (finished trace width less than .003”) |
| Layer to Layer registration | .005 |
| Max. Overall Board thickness | .2” |
| Min. Overall Board thickness | .012” (2layer) .016” (4layer) |
| Min. Core Dielectric thickness | .003” |
| Min Prepreg Dielectric thickness | 0025” |
| Layer count | 36 layer (practical experience) |
| Line to SMT Min. space | .003” |
| Min. Base Copper weight | .0007” |
| Biggest Board Size | 30” x 20” |
| Fabrication Radius | .031” |
| Warpage | .75% |
| Tolerance-Plated hole +/- | .003” |
| Tolerance-Non Plated hole +/- | .002” |
| Impedance Tolerance +/- | 10% |
| Limited solder mask annual ring | 2.5mil (.075mm) |
| Solder mask print registration tolerance | +/-2mil |
| Controlled depth drilling tolerance | +/-4mil |
| Feature | ||
| Production Capacity | 350,000M2/month | |
| Layer (Mass Production) | 1~36 Layers | |
| Minimum Thickness of CCL | 0.075mm (Not including copper) | |
| Board Thickness | 0.30~6.5mm | |
| Material | FR4 & Halogen Free & CEM-3 & FR5 & PTFE & Rogers & Getek & BT & Polyimide FR4 (Dciyfree) &Thermal Prepreg & Aluminum base; buried capacitance | |
| Inner Opening (min) | (1) 4/L – 0.125mm; (2) 6/L-8/L – 0.13mm; (3) 8/L or above – 0.175mm |
|
| Tolerances for NPTH hole | +0/-0.02mm | |
| Plating Hole | Min. Hole Size | 0.15mm(drill) |
| Aspect Ratio (max) | 10 | |
| Tolerances for PTH Hole | ±0.0375mm | |
| Position Accuracy | ±0.05mm | |
| Micro via | Min Hole Size | 0.1mm |
| Aspect Ration (max) | 1:1 | |
| Outer D/F Accuracy | ±0.05mm (Manual), ±0.03mm( Auto) | |
| Min. Line Width/ Space | 0.066mm/0.066mm(A/W) | |
| Solder Mask Bridge | 0.075mm | |
| PCB external dimension tolerances (Routing) | ±0.10mm | |
| Impedance Control | ±8% | |
| Wrap/Twist | 0.5% | |
| Final thickness Tolerance | ± 6% | |